Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits

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dc.contributor.authorRamanath, Ganpati
dc.contributor.authorCui, Ganglong
dc.contributor.authorGanesan, P Gopal
dc.contributor.authorGuo, X
dc.contributor.authorEllis, Amanda Vera
dc.contributor.authorStukowski, Michael
dc.contributor.authorVijayamohanan, Kunjukrishna Pillai
dc.contributor.authorDoppelt, Pascal
dc.contributor.authorLane, Michael W
dc.date.accessioned2010-07-27T05:44:14Z
dc.date.available2010-07-27T05:44:14Z
dc.date.issued2003en
dc.identifier.citationRamanath, G., Cui, G., Ganesan, P.G., Guo, X., Ellis, A.V., Stukowski, M., Vijayamohanan, K., Doppelt, P., & Lane, M., 2003. Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits. Applied Physics Letters, 83(2), 383-385.en
dc.identifier.doihttps://doi.org/10.1063/1.1591232en
dc.identifier.issn0003-6951
dc.identifier.rmid2006005976
dc.identifier.urihttp://hdl.handle.net/2328/8614
dc.oaire.license.condition.licenseIn Copyright
dc.subject.forgroup0299 Other Physical Sciencesen
dc.subject.forgroup0100 Mathematical Sciencesen
dc.subject.forgroup0200 Physical Sciencesen
dc.subject.forgroup0900 Engineeringen
dc.titleSelf-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuitsen
dc.typeArticleen
local.contributor.authorOrcidLookupEllis, Amanda Vera: https://orcid.org/0000-0002-0053-5641en_US
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